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International Journal of Pure & Applied Bioscience (IJPAB)
Year : 2016, Volume : 4, Issue : 4
First page : (179) Last page : (184)
Article doi: http://dx.doi.org/10.18782/2320-7051.2316

Impact of Heat Stress on Yield and Yield Attributing Traits in Wheat (Triticum aestivum L.) Lines during Grain Growth Development

Navnesh Kumar1, Shambhoo Prasad1*, Rakesh Dwivedi1, Ajay Kumar1, R. K. Yadav2, M. P. Singh2 and Sujit Sumar Yadav3
1Department of Plant Molecular Biology and Genetic Engineering, Narendra Deva University of Agriculture and Technology, Kumarganj, Faizabad (U.P.), India
2Department of Crop Physiology, Narendra Deva University of Agriculture and Technology, 
Kumarganj, Faizabad (U.P.), India
3U.P. Council of Agricultural Research, Luchnow, U.P. India
*Corresponding Author E-mail: shambhoonduat@gmail.com
Received: 15.06.2016  |  Revised: 26.06.2016   |  Accepted: 28.06.2016  

Abstract
A field study was conducted with seven wheat lines NDL-10-2, NDL-9-4, NDL-12-1, NDL-12-3, KO-307, NDL-12-2 and NDL-12-4 to assess heat stress effects on yield and yield related traits of wheat. Heat stress was induced by delayed sowing of 60 days from normal date of sowing so that grain filling stage of wheat could experience severe heat stress. Data related to no. of tillers, plant height, spike length, no. of grain per spike, grain yield per plant and test weight of wheat lines were taken in control and heat stress condition. On the basis of yield and yield attributing traits, three wheat lines NDL-10-2, NDL-9-4 and NDL-12-4 showed heat tolerant while NDL-12-1, NDL-12-3, KO-307 and NDL-12-2 appeared as susceptible under heat stress conditions.

Key words:Heat Stress, Wheat, Grain, Yield

Full Text : PDF; Journal doi : http://dx.doi.org/10.18782


Cite this article: Kumar, N., Prasad, S., Dwivedi, R., Kumar, A., Yadav, R.K., Singh, M.P. and Yadav, S.S., Impact of Heat Stress on Yield and Yield Attributing Traits in Wheat (Triticum aestivum L.) Lines during Grain Growth Development, Int. J. Pure App. Biosci.4(4): 179-184 (2016). doi: http://dx.doi.org/10.18782/2320-7051.2316